Nidec SV TCL will be participating at TestConX May 1-4 at the Doubletree by Hilton in Mesa, Arizona. TestConX is the premier event for what is current and upcoming in the packaged IC test industry, bringing together test professionals from all over the world. Visit Nidec SV TCL at the Vendor EXPO, Booth 38 to learn more about our MEMSFlex™ products and the rest of our innovative line of test products!