Wafer Level Chip Scale Package is fast becoming popular with applications such as Wifi, Bluetooth and GPS units utilizing this type of chip because of its small form factor. The WLCSP is also very cost-effective with a simplified manufacturing process that eliminates the need for the final or package test step.

SV's new SpringTouch™ is an ideal solution for WLCSP test with spring pin probes that have the capability to overcome the bump height variation across the wafer. The crown-tip shape self-aligns to the solder bump, eliminating deformation and the need for reflow. The SpringTouch is capable of pitches as low as 150um and can be adapted for testing singulated die.

For more information, please contact an SV Probe Sales Representative.