As semiconductor manufacturers continue to shrink die geometries, making the task of on-wafer testing increasingly more difficult, SV Probe must continuously create new and innovative testing solutions. In order to meet these ever-changing testing requirements, SV introduces its brand new unified line of Vertical probe card products, Trio™, bringing together the best Vertical technology in the industry.
The Trio™ probe card ensures higher accuracy and repeatable wafer testing, and is perfect for memory, microprocessor and logic device applications. Current IC designs and increasing I/O requirements can effectively utilize the unique design of the Trio™, regardless of layout or number of probes. With this probe card, customers can increase test yields while reducing test time and operating cost by probing multiple dies, controlling contact force, planarity and alignment.
Trio™ cards also allow for probe tips to be placed in any area of the chip design, supporting matrix array. The alignment and planarity will remain within specification, and contact force will be uniform - regardless of the deflection. Other advantages include durability, interchangeability, single probe replacement, and increased probe density.
SV's Trio™ is a reliable solution with the ability to address wafer testing challenges in an economical manner. It is the right match for all of your vertical testing needs.
