SV Probe's Trio™ is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application.

SV’s Trio probe card ensures higher accuracy and repeatable wafer test, allows for high pin counts and is perfect for flip chip bump, memory, microprocessor and logic device applications. Current IC designs and increasing I/O requirements can effectively utilize the design of the Trio, regardless of layout or number of probes. With this probe card, customers can increase test yields while reducing test time and operating cost by probing multiple dies, controlling contact force, planarity and alignment. Probe tips can also be placed in any area of the chip design, supporting matrix array. Trio advantages include durability, interchangeability, single probe replacement, increased probe density >10,000, and optional PowerPlus probe material for applications requiring increased power delivery.

The Trio also has the capability of utilizing a variety of Space Transformer (ST) interconnects. Available Space Transformers include Multi-Layer Organic/Multi-Layer Ceramic (MLO/MLC), Wired, Direct Attach and our newest ST innovation, the patent-pending Modular Space Transformer™, an all-inclusive interconnect and contactor in one compact unit. It allows internal components, has excellent electrical performance, and is design flexible - all of which create a lower cost of probe card ownership.

Contact your SV Probe Representative so we can help you find the right Trio product for your vertical testing needs.

semiconductor manufacturers continue to shrink die geometries, making the task of on-wafer testing increasingly more difficult, SV Probe must continuously create new and innovative testing solutions. In order to meet these ever-changing testing requirements, SV offers its line of vertical probe card products, Trio™, bringing together the best Vertical technology in the industry.

The Trio™ probe card ensures higher accuracy and repeatable wafer testing, and is perfect for memory, microprocessor and logic device applications. Current IC designs and increasing I/O requirements can effectively utilize the unique design of the Trio™, regardless of layout or number of probes. With this probe card, customers can increase test yields while reducing test time and operating cost by probing multiple dies, controlling contact force, planarity and alignment.

Trio™ cards also allow for probe tips to be placed in any area of the chip design, supporting matrix array. The alignment and planarity will remain within specification, and contact force will be uniform - regardless of the deflection. Other advantages include durability, interchangeability, single probe replacement, and increased probe density.

SV's Trio™ is a reliable solution with the ability to address wafer testing challenges in an economical manner. It is the right match for all of your vertical testing needs.