As semiconductor manufacturers continue to shrink die geometries, making the task of on-wafer testing increasingly more difficult, SV Probe must continuously create new and innovative testing solutions. In order to meet these ever-changing testing requirements, SV offers its line of vertical probe card products, Trio™, bringing together the best Vertical technology in the industry.
The Trio™ probe card ensures higher accuracy and repeatable wafer testing, and is perfect for memory, microprocessor and logic device applications. Current IC designs and increasing I/O requirements can effectively utilize the unique design of the Trio™, regardless of layout or number of probes. With this probe card, customers can increase test yields while reducing test time and operating cost by probing multiple dies, controlling contact force, planarity and alignment.
Trio™ cards also allow for probe tips to be placed in any area of the chip design, supporting matrix array. Other advantages include durability, interchangeability, single probe replacement, and increased probe density.
Recently, SV introduced PowerPlus™, a new vertical probe solution targeted towards high density ICs that
require probe cards with tighter pad pitches and the ability to test at a higher power level. Trying to meet the critical power requirements of these new and complex types of devices with traditional probes can drive the power output over the edge, creating probe instability and test failures. SV’s PowerPlus™ vertical probe addresses this power dilemma by utilizing an advanced probe material that provides a significant power increase over traditional probes. The PowerPlus™ also improves scrubs and contact resistance by operating far from the power limit where the fundamental probe behavior starts to change. Contact your sales representative to learn more about PowerPlus™.
SV's Trio™ is a reliable solution with the ability to address wafer testing challenges in an economical manner. It is the right match for all of your vertical testing needs.
