The shrinking of die geometries and the growing complexity of device designs are making the task of on-wafer testing increasingly more difficult. In order to meet these ever-changing test requirements, SV Probe must continually create new and innovative solutions. SV’s solution to this particular challenge is the MEMS-based, fine pitch vertical LogicTouch™ probe card, targeted for pad-limited devices such as High-Volume SoCs, Microcontrollers, DSPs and 3D Packages.

The LogicTouch is versatile, with no chip design limitations up to four rows, corner pad probing and is single pin repairable. Utilizing a MEMS-style probe, the LogicTouch also offers greater scrub consistency and more dimensional control, essential for minimizing pad damage to complex devices that are more sensitive and require precision probing. LogicTouch is ideal for the latest applications including TSV (Through-Silicon Via) and Copper Pillar (Cu-Pillar).

Another LogicTouch benefit is that is can be paired with SV's newest space transformer innovation, the Modular Space Transformer™, a perfect counterpart for the LogicTouch because of its fine pitch capabilities. Our patent-pending Modular ST contains both the interconnect and the contactor in one compact unit. It allows internal components, has excellent electrical performance, and is design flexible - all of which create a lower cost of probe card ownership.

Please contact an SV Probe Representative for more information on the LogicTouch™ probe card.