• Trio Vertical

    SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application. 

         • 20K+ Probes
         • Flat or Pointed Tip Shapes
         • Variety of Build Options
            - High Density
            - Multiple Die
            - Matrix Array
         • Applications
            - Flip Chip Bump
            - Memory
            - Microprocessor
            - Logic

    The Trio also has the capability of utilizing a variety of Space Transformer (ST) interconnects. Available Space Transformers include Multi-Layer Organic/Multi-Layer Ceramic (MLO/MLC), Wired, Direct Attach and our newest ST innovation, the Modular Space TransformerTM, an all-inclusive interconnect and contactor in one compact unit. It allows internal components, has excellent electrical performance, and is design flexible - all of which create a lower cost of probe card ownership. 

    Contact your SV TCL Representative so we can help you find the right Trio product for your vertical testing needs.