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  • SpringTouch™ Spring Pin Probe Cards

    Because of the small form factor, Wafer Level Chip Scale Packages are utilized in a number of applications such as Wifi, Bluetooth and GPS units. The WLCSP is also very cost-effective with a simplified manufacturing process that eliminates the need for the final or package test step.

    Nidec SV TCL's SpringTouchTM is an ideal and economical solution for WLCSP test with spring pin probes that have the capability to overcome the bump height variation across the wafer.
    Other benefits include:
         • Crown-shaped Probes
         • Pitch Capability as Low as 400µm
         • RF Capability
         • Easy Pin Replacement
         • Socket Adapter for Single Chip Testing

    Contact your Nidec SV TCL Representative so we can help you find the right SpringTouchTM product for your vertical testing needs.