• Metrology

    SV TCL has a wide variety of world-class analytical resources, allowing us to visually examine detailed wafer-scale features and analyze the performance of our probe cards. Our capabilities include:


         • Scanning Electron Microscopy
         • Electron Dispersive Spectrometry
         • Profilometery
         • RF Performance Characterization
         • Single Pin Video Capability


         • HFSS - 3D/2D Analysis
         • ADS Complete Circuit Simulation
         • Mechanical Enterprise FEA
         • PI/SI Simulation

    SV TCL also has the capability to emulate the testing environment with multiple probe card metrology tools supporting multiple tester platforms and interfaces, including direct dock. SV TCL is dedicated to continuous product improvement so that we can provide our customers the latest and most innovative test solutions.