SV TCL is now a part of Nidec-Read Corporation, click here to learn more!
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  • Trio Vertical

    Nidec SV TCL's TrioTM is a reliable solution for advanced wafer testing challenges, specifically full array and parallel probing. We offer a complete line of vertical probe card products, each designed for your unique application. 

         • 30K Probes
         • Flat or Pointed Tip Shapes
         • Variety of Build Options
            - High Density
            - Multiple Die
            - Matrix Array
         • Applications
            - Small Pad
            - Cu-Pillar
            - Micro Bump
            - TSV

    The Trio also has the capability of utilizing a variety of Space Transformer (ST) interconnects. Available Space Transformers include Multi-Layer Organic/Multi-Layer Ceramic (MLO/MLC), Wired, Direct Attach and our newest ST innovation, the Modular Space Transformer (MSTTM), an all-inclusive interconnect and contactor in one compact unit. It allows internal components, has excellent electrical performance, and is design flexible - all of which create a lower cost of probe card ownership. 

    Contact your Nidec SV TCL Representative so we can help you find the right TrioTM product for your vertical testing needs.