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  • LogicTouch™ MEMS

    The shrinking of IC die geometries and the growing complexity of device designs are making the task of on-wafer testing increasingly more difficult. SV TCL's LogicTouchTM is suited perfectly for these types of advanced designs, a fine pitch technology utilizing a MEMS-style probe targeted for pad-limited devices such as High-Volume SoCs, Microcontrollers, DSPs and 3D Packages. LogicTouch is also ideal for the latest device applications including TSV (Through-Silicon Via) and Copper Pillar (Cu-Pillar).

         • Fine Pitch Capability Down to 50µm
         • No Chip Design Limitations
            - Probe Arrays
            - Corner Pads
         • Single Pin Repairable
         • MEMS-Style Probes
            - Greater Scrub Consistency
            - More Dimensional Control

    Contact your SV TCL Representative so we can help you find the right LogicTouch product for your vertical testing needs.