Nidec SV TCL will be participating at TestConX (Formerly BiTS), March 3-6 at the Hilton Phoenix/East Mesa in Mesa, Arizona. TestConX is the premier event for what is current and upcoming in the packaged IC test industry, bringing together test professionals from all over the world. Visit Nidec SV TCL at the Vendor EXPO, Booth 39 to learn more about our MEMS Spring Pins and the rest of our innovative line of test products!